IRPS Year-in-Review

Inside Program: Conference Program l Keynote Speakers l Tutorials
Workshops l Year in Review l Highlighted Paper l Invited paper

The IRPS Reliability Year-in-Review (YiR) session consists of 3 presentations reviewing the past year's reliability work by experts in the field for areas of high interest. It is an excellent augmentation to the tutorial sessions immediately preceding, and attendees may obtain keen reliability insights in a short amount of time.

TBD

Archives

IRPS 2023 Year in Review

Soft Error in Planar, FDSOI, FinFET, and GAA by Taiki Uemura (Samsung Electronics)
SiC Devices by Daniel J. Lichtenwalner (Wolfspeed, A Cree Company)
FEOL reliability of fin, NW, NS FETs by Stanislav Tyaginov, Michiel Vandemaele, Erik Bury (imec)

IRPS 2022 Year in Review

3D IC Packaging by Kangwook (Kriss) Lee, (SK Hynix)
Emerging Memory Reliability (MRAM, RRAM, PCM, Ferroelectrics) by Shimeng Yu, (Georgia Tech)
Reliability and aging aware designs / Circuit reliability by Evelyn Landman, (Protean Tecs)

IRPS 2021 Year in Review

FinFET vs GAA : Main reliability Differences and Concerns by Adrian Chasin (imec)
Reliability Testing: Considerations for Physics-Based Reliability Testing Development by Derek W. Slottke (Intel)
Industry Council on ESD Target Levels: Review of Achievements, Activities, and Initiatives by Charvaka Duvvury (ESD consulting)