March 29 - April 2, Dallas, Texas
Soliciting Increased Participation in the Following Areas:
Wide bandgap; 2.5/3D packaging; ESD in advanced nodes
Emerging memory reliability; Circuit and System reliability and aging;
Beyond CMOS – reliability issues; Reliability and testing challenges in automotive electronics
Programs are co-located again!
Joint Poster Session!
IRPS keynotes are available to all attendees.
IEW keynote and invited talks are also available to all attendees.
For 58 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world…
For 58 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world…
