• Packaging and 2.5 / 3D Assembly

• Circuit Reliability and Aging

• Gate / MOL Dielectrics

• Emerging Memory Reliability

• ESD and Latchup

• Failure Analysis

• GaN Power Devices

Packaging and 2.5D/3D Assembly

• Chair: Ravi Aggarwal, Intel

• Vice-Chair: Jyun-Lin Wu, TSMC

• Chair Emeritus: Keith Newman, AMD

  Mudasir Ahmad, Google
  Nicholas Ginga, The University of Alabama in Huntsville
  Anil Indluru, Google
  Chang-Chun Lee, National Tsing Hua University (NTHU)
  Kangwook Lee, SK Hynix
  Khai Nguyen, Nvidia
  Nipun Sinha, Meta
  Fubin Song, Amazon
  Yangyang Sun, Qualcomm
  Yaodong Wang, Apple
  Zhi Yang, Groq

Circuit Reliability and Aging

• Chair: Javier Diaz Fortuny, Imec

• Vice-Chair: Jeff Gambino, Onsemiconductor

• Chair Emeritus: Kanad Basu, University of Texas at Dallas

  Ricardo Ascazubi, Intel
  Castro Lopez, IMSE-CNM
  Albert Crespo Yepes, Universitat Autonoma de Barcelona
  Richard Heller, AMD
  Mitsuhiko Igarashi, Renesas Electronics
  Robert Jin, NXP
  Saibal Mukhopadhyay, Georgia Institute of Technology
  Vijay Reddy, Texas Instruments
  Mattia Rossetti, ST Microelectronics
  Jordi Sacristan, IMB-CNM
  Christian Schluender, Infineon Technologies AG
  Hyewon Shim, Samsung
  Victor M. van Santen, Technical University of Munich
  Graham Woods, Synopsys
  Mustafa Berke Yelten, Istanbul Technical University

Gate/MOL Dielectrics

• Chair: Pei Jean Liao, TSMC

• Vice-Chair: Gerhard Rzepa, Global TCAD

• Chair Emeritus: Zakariae Chbili, Intel

  Ruben Asanovski, imec
  Masakazu Goto, Kioxia
  Oscar Huerta Gonzalez, GlobalFoundries
  Fei Hui, Zhengzhou University
  Felix Palumbo, Allegro MicroSystems
  Nagarajan Raghavan, Singapore University of Technology and Design
  Susanna Reggiani, University of Bologna
  Suresh Uppal, Rivos
  Ernest Wu, IBM

Emerging Memory

• Chair: Jaeyun Yi, SK Hynix

• Vice-Chair: Kai Ni, University of Notre Dame

• Chair Emeritus: Carlo Cagli, ST Microelectronics

  Wei-Chen Chen, Macronix
  Devanarayanan Ettisserry, Micron
  Davide Fugazza, Intel
  Laurent Grenouillet, CEA-Leti
  Yusuke Higashi, imec
  Keizo Hiraga, Sony
  Hyunsung Jung, Samsung
  Hyungjin Kim, Hanyang University
  Seyoung Kim, Postech
  Dutta Sourav, University of Texas at Dallas

ESD and Latchup

• Chair: Mariano Dissegna, Texas Instruments

• Vice-Chair: Mirko Scholz, Infineon Technologies

• Chair Emeritus: Lorenzo Cerati, ST Microelectronics

  Dolphin Abessolo Bidzo, NXP
  Shih-Hung Chen, imec
  ChanHee Jeon, Samsung
  Teruo Suzuki, Socionext
  Prantik Mahajan, Renesas Electronics
  Nathaniel Peachey, Qorvo
  Steven S. Poon, TSMC

Failure Analysis

• Chair: Daniel Sullivan, EAG Laboratories

• Vice-Chair: Yong Guo, Samsung

  Sean Beck, Little Fuse
  Jayeshkumar Das, ORS Labs
  Hugh Gotts
  Jesse Guzman, Meta
  Joshi Kaustubh, Intel
  Tim Watson, Watson Analytical

GaN Device

• Chair: Davide Bisi, Transphorm Inc.

• Vice-Chair: Matteo Meneghini, University of Padova

• Chair Emeritus: Andrew Binder, Sandia National Lab

  Matteo Borga, imec
  Julien Buckley, CEA/LETI
  Okita Hideuki, Panasonic
  Christian Koeller, Infineon
  Sara Martin Horcajo, Nexperia
  Maurizio Millesimo, University of Bologna
  Rajarshi Roy Chaudhuri, IISc Bangalore
  Bhawani Shankar, Power Integrations
  Kurt Smith, VisIC Technologies
  Tsutomu Uesugi, Nagoya University
  Shuzhen You, Xidian University
  Nicolò Zagni, Universita' di Modena e Reggio Emilia

Memory Reliability

• Chair: Cristian Zambelli, University of Ferrara

• Vice-Chair: Biswajit Ray, Colorado State University

  Jaeduk Lee, Samsung
  Ming-Yi Lee, Macronix
  Nellina Mautone, Infineon
  Gabriele Navarro, CEA-Leti
  Seong Wan Ryu, SK Hynix
  Naoki Yasuda, Kioxia
  Fang Zhou, Microchip

Metallization / BEOL Reliability

• Chair: Cher Ming Tan, Chang Gung University

• Vice-Chair: Ping-Chuan Wang, SUNY New Platz

• Chair Emeritus: Seungman Choi, GlobalFoundries

  Arief Budiman, Oregon Institute of Technology
  Kristof Croes, imec
  Gavin Hall, Infineon
  Sumy Jose, NXP
  Ki-Don Lee, Samsung
  Ming-Hsieh Lin, TSMC
  Atsushi Ogino, IBM
  Valeriy Sukharev, Siemens EDA
  Shinji Yokogawa, Univ. Electro-Communications

Neuromorphic Computing Reliability

• Chair: Gennadi Bersuker, M2D

• Vice-Chair: An Chen, IBM

• Chair Emeritus: Bin Gao, Tsinghua University

  Hiro Akinaga, National Institute of Advanced Industrial Science and Technology (AIST)
  Yao-Feng Chang, Intel
  Regina Dittmann, PGI Juelich
  Arthur Edwards, AFRL/RVSV
  Tuo-Hung Hou, National Yang Ming Chiao Tung University
  Doo Seok Jeong, Hanyang University
  Masaharu Kobayashi, University of Tokyo
  Matthew Marinella, Arizona State University
  Gabriel Molas, Weebit
  Nagarajan Raghavan, Singapore University of Technology and Design
  Sabina Spiga, CNR
  Tommaso Zanotti, università di Modena e Reggio Emilia

Process Integration

• Chair: Jean Coignus, CEA Leti

• Vice-Chair: Motoyuki Sato, Tokyo Electron

• Chair Emeritus: Richard G (Ricki) Southwick, IBM

  Cheikh Diouf, ST Microelectronics
  Alexander Grill, imec
  Jen-Hao Lee, TSMC
  Chandra Mandalapu, AMD
  Andreas Martin, Infineon
  Hiroshi Miki, Rapidus
  Mustapha Rafik, Aledia
  Rakesh Ranjan, Samsung
  Hyunchul Sagong, KATECH
  Guido Sasse, NXP
  Purushothaman Srinivasan, GlobalFoundries
  Alexandre Subirats, Micron

Product Reliability

• Chair: Yuan Zhang, Amazon

• Vice-Chair: Hank Hsieh, MediaTek

• Chair Emeritus: Feng Xia, Intel

  Davide Appello, Technoprobe
  Jotika Athavale, Synopsys
  Sandhya Chandrashekhar, Google
  Ryan Lu, TSMC
  Richard Rao, Marvel
  Mihaela (Maria) Tanasescu, AMD
  Xinggong Wan, GlobalFoundries
  Eric Wang, Nvidia
  Robert Wu, NXP

Reliability Testing

• Chair: Fiorella Pozzobon, ST Microelectronics

• Vice-Chair: Martina Hommel, Robert Bosch GmbH

• Chair Emeritus: Jifa Hao, Google

  Hosain Farr, Qualitau Inc.
  Yanjun Feng, Canoo Inc.
  Lakshmi Kari, Qualcomm
  Jin Soak Kim, Samsung
  Linfei (Jamie) Li, Cadence
  Kevin Manning, Analog Devices
  David McElfresh, Ultra Communications
  Yiming Qu, East China Normal University
  Dirk Rudolph, Globalfoundries
  Derek Slottke, Intel
  Wangran Wu, Southeast University
  Yi Zhao, Zhejiang University
  Bob Keller, NIST

RF / mmW / 5G

• Chair: Purushothaman Srinivasan, Globalfoundries

• Vice-Chair: Alexis Divay, CEA Leti

• Chair Emeritus: Sriram Kalpat, Qualcomm

  Michael Dammann, Fraunhofer Institute
  Gergana Drandova, Qorvo
  Vijay Reddy, Texas Instruments
  Rosana Rodriguez, Universitat Autonoma de Barcelona
  Hao Yu, imec
  Celestin Doyen, ST Microelectronics
  Enrico Zanoni, University of Padova

Radiation Effect Reliability (Soft Errors)

• Chair: Rita Fung, Cisco

• Vice-Chair: Sang Baeg, Hanyang University

• Chair Emeritus: Chundong Liang, Amazon

  Laurent Artola, ONERA
  Indranil Chatterjee, Airbus
  Li Chen, University of Saskatchewan
  Yueh (Rick) Chiang, TSMC
  Philippe Roche, ST Microelectronics
  Taiki Uemura, Samsung
  Enxia Zhang, University of Central Florida

System Electronics Reliability

• Chair: Florian Moliere, Airbus

• Vice-Chair: David Sunderland, Boeing (retired)

  Jyotika Athavale, NVIDIA
  Timothy Ayles, Synopsys
  Brad Bittel, Intel
  Ivan Ciofi, imec
  Yi-Ching (YC) Ong, TSMC
  Nikolaos Papandreou, IBM Research Zurich
  Jay Sarkar, Micron

Transistors

• Chair: Pragya Shrestha, NIST

• Vice-Chair: Alain Bravaix, IM2NP (ST Micro)

• Chair Emeritus: Eunae (Grace) Chung, Samsung

  Adrian Chasin, imec
  Nilesh Goel, BITS Pilani Dubai Campus
  Subhadeep Mukhpadhyay, Intel
  Balaji Narasimham, Broadcomm
  Uma Sharma, Micron
  Seunghun Son, SK Hynix
  Dhanoop Varghese, Texas Instruments
  Michael Waltl, TU Wien
  Miaomiao Wang, IBM
  Zhuoqing Yu, Huawei HiSilicon
  Lining Zhang, Peking University

SiC Devices

• Chair: Junji Senzaki, AIST

• Vice-Chair: Patrick Fiorenza, Italian National Research Council

• Chair Emeritus: Ulrike Grossner, ETH Zurich

  Akin Akturk, CoolCAD Electronics
  Thomas Basler, TU Chemnitz
  Alexander Boltnikov, On-Semiconductor
  Kiran Chatty, Alpha Omega Semiconductor
  Charles Cheung, NIST
  Ron Green, US Army Research Lab.
  Elena Mengotti, ABB Research Center