Circuit Reliability and Aging – Includes digital, mixed-signal, power and RF applications; design for reliability; variability-aware design, EDA tools and compact modeling

ESD and Latchup – Includes component and system-level ESD design; modeling and simulation

Packaging and 2.5D/3D Assembly – Includes chip-package interaction; fatigue; power dissipation issues; reliability of 2.5D and 3D IC packaging and integration, interconnects, multichip modules, passive interposers

Product Reliability – Includes automotive, industrial, commercial, military grade IC/product qualification, HTOL/production burn-in; early failure rate; defect detection; failure analysis; root cause and corrective action, product reliability modeling and risk analysis; on-chip sensors; silicon photonics; multichip/chiplet product, 2D/3D chiplet product, stacked and HBM memory; DFT/DFR solutions for improved reliability; chipset reliability considerations including electrical, environmental, thermal and mechanical risks.

Radiation Effects Reliability – Includes basic mechanism and impact analysis of radiation effects on components and systems; Component, system and application-level modeling, simulation, testing, and mitigation techniques for radiation effects induced reliability issues.

Reliability Testing – Includes reliability equipment, tools, test structures, and test methods; design for reliability testing

RF/mmW/5G – Reliability of CMOS, BiCMOS, SiGe, SOI, LDMOS, GaN, and other III-V devices in high frequency applications

Silicon Photonics – Including reliability of integrated silicon photonics systems

System Electronics Reliability – Reliability of electronic systems used in a variety of applications including but not limited to consumer electronics, data centers, health care, space and automotive industries; architecture, design and modeling of system reliability including “row hammer” scenarios, telemetry data collection and large-scale analysis techniques such as machine and deep learning, and neuromorphic computing.

Beyond CMOS Devices – Includes reliability of tunnel FETs, transistors with 2D semiconductors (graphene, MoS2); ferroelectric and negative capacitance FETs; spintronics

Emerging memory – Novel memory devices based on magnetics (e.g., STT, SOT, VCMA), or resistive (selector or memory element) RAM, ferroelectrics, or phase change memory

Failure Analysis – Includes evidence of new failure mechanisms; advances in failure analysis techniques

Gallium-Nitride and Silicon-Carbide Wide-Bandgap Semiconductors – threshold voltage instabilities, charge trapping, switching stress, breakdown and other reliability topics including thermal issues within power devices.

Gate/MOL/BEOL Dielectrics – Includes reliability of novel gate dielectrics and ferroelectrics; 2D layered dielectrics and van der Waals dielectrics for 2D materials-based devices; modeling of dielectric breakdown; gate dielectric reliability for III-V, Ge, and advanced FETs; middle-of-the-line reliability; MIM/MOM capacitors; low-k dielectric breakdown

Compound and Optoelectronic Devices – Includes reliability of III-V-based devices, optoelectronic devices; far infrared detectors.

Memory Reliability – Includes stand-alone DRAM, 3DNAND, and embedded memories

MEMS – Includes reliability of sensors and actuators; reliability testing; analysis & modeling; BioMEMS

Metallization/BEOL Reliability – Includes electro-migration; Joule heating; stress migration;

Neuromorphic Computing Reliability – Reliability of logic and memory (MRAM, RRAM, etc.) devices and design architectures used in neuromorphic computing and AI acceleration.

Process Integration – Includes manufacturing process such as PID/charging, anneals/implants etc. impact on component reliability, existing and new process-related reliability issues in production; foundry reliability challenges

Transistors – Includes hot carrier phenomena; BTI; RTN; advanced node scaling; variability; Ge and III-V channels; nano-wire, gate all-around, nano-ribbon, fork-sheet devices