IRPS

2020 IRPS Invited speakers

TypeTopicTitleSpeakerAffiliation
Focus SessionReliability of SiC Devices IRuggedness of SiC devices under extreme conditionsPeter FriedrichsInfineon
Focus SessionReliability of SiC Devices IIChallenges and peculiarities in developing new standards for SiCDon GajewskiCree/Wolfspeed
Focus SessionReliability of SiC Devices III Defect spectroscopy in SiC devicesMichael WaltlTU Vienna
Focus SessionNeuromorpic Computing Reliability
I
Introduction of Computing in Memory (CIM) by 3D NAND Flash and the Reliability Aspects to Ensure the Accuracy for the Deep-Learning Neural NetworkHang-Ting LueMacronix
Focus SessionNeuromorpic Computing Reliability
II
Embracing the Unreliability of Memory Devices for Neuromorphic ComputingCharles MackinIBM, Almaden
Focus SessionNeuromorpic Computing Reliability
III
Embracing the Unreliability of Memory Devices for Neuromorphic ComputingDamien QuerliozU. Paris-Sud
Focus SessionCircuit Reliability and Aging IExperimental monitoring of aging in CMOS RF linear power amplifiers: correlation between device and circuit degradationRosana Rodriguez MartinezUniversitat Autonoma de Barcelona
Focus SessionCircuit Reliability and Aging IIA novel approach to in-field, in-mission reliability monitoring based on deep dataEvelyn LandmanCTO, ProteanTecs
Focus SessionCircuit Reliability and Aging IIIAging challenges in on-chip voltage regulator designSaibal MukhopadhyayGeorgia Tech
Focus SessionCircuit Reliability and Aging IVAn industry-standard approach toward modeling device agingColin ShawSi2 / Silvaco
Focus SessionRF/mmW/5G ISilicon Based RF Reliability Challenges for 5G CommunicationPaul ColestockGlobalFoundries
Focus SessionRF/mmW/5G IIThe role of RF operational life testing in evaluating III-V devices addressing RF through millimeter-wave applicationsElias ReeseQorvo
Focus SessionRF/mmW/5G IIIReliability physics of GaN HEMT microwave devices: the age of scalingEnrico ZanoniUniv of Padova
Regular SessionTransistorsFEOL Reliability Issues in Advanced CMOS NodesInanc MericIntel
Regular SessionPackaging and 2.5/3D AssemblyMaterials and Reliability of Photonic PackagingJohn OsenbachInfinera
Regular SessionSystem Electronics ReliabilityChallenges in Prognostics and Health Management of Electronic SystemsMichael AzarianUniv Maryland/CALCE
Regular SessionFailure AnalysisLocalization of high speed failures with a novel detection methodEd ColeSandia