| 2B.1 (Invited) | Progress and Current Topics of JEDEC JC-70.1 Power GaN Device Quality and Reliability Standards Activity | Wide-Bandgap Semiconductors- GaN | Tim | McDonald | Infineon, Chair, JEDEC JC-70.1 |
| | | Stephanie | Watts Butler | Texas Instruments, Chair, JEDEC JC-70 |
| 2C.1 (Focus) | Conductance variations and their impact on the precision of in-memory computing with resistive switching memory (RRAM) | Neuromorphic Computing Reliability | Daniele | Ielmini | Politecnico di Milano |
| 2C.2 (Focus) | Embedded emerging memory technologies for neuromorphic computing: temperature instability and reliability | Neuromorphic Computing Reliability | Yao-feng | Chang | Intel |
| 2D.1 (Focus) | Can Emerging Computing Paradigms Help Enhancing Reliability Towards the End of Technology Roadmap? | Neuromorphic Computing Reliability | Runsheng | Wang | Peking University |
| 3B.1 (Focus) | New Developments in SiGe HBT Reliability for RF Through mmW Circuits | RF/mmW/5G Reliability | John | Cressler | Georgia Tech |
| 3B.2 (Focus) | Reliability and Failure Analysis of 100 nm AlGaN/GaN HEMTs under DC and RF Stress | RF/mmW/5G Reliability | Michael | Dammann | Fraunhofer Institute IAF |
| 3D.1 (Invited) | Single Event Hard Error Due to Terrestrial Radiation | Soft Error | Jin-Woo | Han | NASA Ames Research Center |
| 3E.1 (Focus) | CMOS RF reliability for 5G mmWave applications – Challenges and Opportunities | RF/mmW/5G Reliability | Purushothaman | Srinivasan | GlobalFoundries |
| 3E.2 (Focus) | Guidelines for Space Qualification of Gan HEMTs and MMICs | RF/mmW/5G Reliability | John R. | Scarpulla | The Aerospace Corporation |
| 3F.1 (Invited) | Back End Of Line Opportunities and Reliability Challenges for Future Technology Nodes | Metallization/BEOL Reliability | Mauro | Kobrinsky | Intel Corporation |
| 3H.1 (Invited) | Challenges of Flash Memory for Next Decade | Memory Reliability | Kazunari | Ishimaru | Kioxia |
| 4A.1 (Invited) | Silicon Lifecycle Management with in-chip Monitoring | Circuit Reliability and Aging | Rajesh | Kashyap | Synopsys |
| 4D.1 (Invited) | Reliability of Optoelectronic Module: An overview | Packaging and 2.5/3D Assembly | John | Osenbach | Infinera |
| 5B.1 (Focus) | Reliability of STT-MRAM for Various Embedded Applications | Emerging Memory Reliability | Shinhee | Han | Samsung Electronic |
| 5B.2 (Focus) | Challenges toward Low-Power SOT-MRAM | Emerging Memory Reliability | Shy-Jay | Lin | TSMC |
| 5C.1 (Invited) | Is There a Perfect SiC MOSFET Device on an Imperfect Crystal? | Wide-Bandgap Semiconductors- SiC | Thomas | Neyer | ON Semiconductor |
| 5C.5 (Invited) | Space Radiation Effects on SiC Power Device Reliability | Wide-Bandgap Semiconductors- SiC | Jean-Marie | Lauenstein | NASA Goddard Space Flight Center |
| 5D.1 (Focus) | Reliability aspects of ferroelectric hafnium oxide for application in non-volatile memories | Emerging Memory Reliability | Thomas | Mikolajick | NamLab and IHM, TU Dresden |
| 5D.2 (Focus) | Ultrathin Ferroelectricity and Its Application in Advanced Logic and Memory Devices | Emerging Memory Reliability | Sayeef | Salahuddin | UC Berkeley |
