IRPS

Topics of Interest

IRPS 2019 is soliciting increased participation in the following areas.

  • Modeling of Circuit Reliability and Aging
  • Beyond CMOS – Reliability Issues in Neuromorphic Computing
  • Reliability Challenges in Automotive Electronics
  • Advanced Packaging (2.5/3D)

Papers in the following areas are requested.

Circuits, Products, and Systems

  • Circuit Reliability and Aging
  • Product IC Reliability
  • Consumer, System and Automotive Electronics Reliability
  • Soft Errors
  • ESD and Latchup
  • Packaging and 2.5D/3D Assembly
  • Reliability Testing
  • Neuromorphic Computing

Materials, Processing, and Devices

  • Transistors
  • Gate and MOL Dielectrics
  • Beyond CMOS Devices
  • Wide-Bandgap Semiconductors
  • Compound and Optoelectronic Devices
  • Back-End Reliability
  • Process Integration
  • Failure Analysis
  • Memory Reliability
  • Photovoltaics
  • MEMS