IRPS

Committee List

IRPS 2019 Committees

This interactive table shows the list of committee chairs, vice-chairs, and past-chairs. The table is sortable by clicking on column headers. The search box uses free-text to find matching instances of whatever is typed. Updates will be added as they become available.

Sub-CommitteeRoleFirst NameLast NameAffiliation
3D/2.5D/PackagingTopic ChairSudarshanRangarajAmazon Lab 126
3D/2.5D/PackagingVice ChairRohitGroverIntel
3D/2.5D/PackagingPast ChairKothandaraman (Raman)KothandaramanIBM Research
3D/2.5D/PackagingNew MemberRaviAggarwalIntel
3D/2.5D/PackagingNew MemberAkashAgrawalAMD
3D/2.5D/PackagingNew MemberKabirEnamulIntel
3D/2.5D/PackagingNew MemberMonaMayehAmazon
3D/2.5D/PackagingNew MemberAshokPachamuthuMaxim Integrated
3D/2.5D/PackagingNew MemberNehaPatelMedtronic
3D/2.5D/PackagingNew MemberPremachandran (Prem)CSGlobal Foundries
3D/2.5D/PackagingNew MemberKanikaSethiIntel
Beyond CMOSTopic ChairGennadiBersukerThe Aerospace Corporation
Beyond CMOSVice ChairMatthewMarinellaSandia National Laboratories
Beyond CMOSNew MemberStefanoAmbrogioIBM Almaden Research Center
Beyond CMOSNew MemberAnChenSRC
Beyond CMOSNew MemberRobinDegraeveIMEC
Beyond CMOSNew MemberArthurEdwardsAir Force Research Laboratory (AFRL)
Beyond CMOSNew MemberAkinagaHiroAdvanced Industrial Science and Technology (AIST), Japan
Beyond CMOSNew MemberTuo-Hung (Alex)HouNational Chiao Tung University, Taiwan
Beyond CMOSNew MemberDoo SeokJeongHANYANG University (Korea)
Beyond CMOSNew MemberRozaKotlyarIntel Corporation
Beyond CMOSNew MemberGabrielMolasLETI (France)
Beyond CMOSNew MemberKin LeongPeySingapore University of Technology and Design
Beyond CMOSNew MemberSabinaSpigaCNR-IMM, Italy
Beyond CMOSNew MemberJohn PaulStrachanHewlett Packard Enterprise
Beyond CMOSNew MemberEric M.VogelGeorgia Institute of Technology
Beyond CMOSNew MemberRainerWaserAachen University
Circuit Reliability/AgingTopic ChairGeorgiosKonstadinidisGoogle
Circuit Reliability/AgingVice ChairJimTschanzIntel
Circuit Reliability/AgingPast ChairChrisKimUniversity of Minnesota
Circuit Reliability/AgingCommittee MemberFlorianCachoSTMicroelectronics
Circuit Reliability/AgingCommittee MemberKarlHofmannInfineon
Circuit Reliability/AgingCommittee MemberKazutoshiKobayashiKyoto Institute of Technology
Circuit Reliability/AgingCommittee MemberTomKopleyONSemiconductors
Circuit Reliability/AgingCommittee MemberPong-FeiLuIBM
Circuit Reliability/AgingCommittee MemberVijayReddyTexas Instruments
Circuit Reliability/AgingCommittee MemberMingooSeokColumbia University
Circuit Reliability/AgingNew MemberHyewonShimSamsung
Circuit Reliability/AgingNew MemberShimengYuArizona State University
ESD/LatchupTopic ChairGianlucaBoselliTexas Instruments
ESD/LatchupVice ChairShih-HungChenIMEC
ESD/LatchupPast ChairMichaelKhazhinskySilicon Labs
ESD/LatchupCommittee MemberLorenzoCeratiST Microelectronics
ESD/LatchupCommittee MemberZhongChenUniversity of Arkansas
ESD/LatchupCommittee MemberKaiEsmarkInfineon
ESD/LatchupCommittee MemberGuidoNotermansNexperia
ESD/LatchupCommittee MemberMototsuguOkushimaRenesas
ESD/LatchupCommittee MemberDionyzPoganiTU Wien
ESD/LatchupCommittee MemberMayankShrivastavaIndian Institute of Science
ESD/LatchupCommittee MemberMichaelStockingerNXP
ESD/LatchupCommittee MemberTeruoSuzukiSocionext Inc.
Failure AnalysisTopic ChairBaohuaNiuTSMC
Failure AnalysisVice ChairJaneLiNVidia
Failure AnalysisPast ChairKevinJohnsonIntel
Failure AnalysisNew MemberJayhoonChungTexas Instruments
Failure AnalysisNew MemberStephenFasolinoRaytheon
Failure AnalysisCommittee MemberBrandenForanThe Aerospace Corporation
Failure AnalysisCommittee MemberEckhardLangerGlobalFoundries
Failure AnalysisCommittee MemberKenRodbellIBM
Failure AnalysisCommittee MemberBryanTracyEAG Laboratories
Failure AnalysisNew MemberJasonWheelerRaytheon
Failure AnalysisNew MemberYifenXieMA-Tek
Gate/MOL DielectricsTopic ChairAndrewKimIBM
Gate/MOL DielectricsVice ChairMarioLanzaSoochow University
Gate/MOL DielectricsPast ChairNagarajanRaghavanSingapore U. of Technology and Design
Gate/MOL DielectricsNew MemberRaviAchantaGlobalFoundries
Gate/MOL DielectricsNew MemberShih-ChangChenTSMC
Gate/MOL DielectricsNew MemberJiezhiChenShandong University
Gate/MOL DielectricsCommittee MemberYung-HueiLeeTSMC
Gate/MOL DielectricsNew MemberEnriqueMirandaUniversitat Autonoma de Barcelona
Gate/MOL DielectricsNew MemberAndreaPadovaniMDLSoft
Gate/MOL DielectricsCommittee MemberFrancesco MariaPuglisiUniMORE
Gate/MOL DielectricsCommittee MemberNaohitoSuzumuraRenesas
Gate/MOL DielectricsCommittee MemberStanislavTyaginovIMEC
Gate/MOL DielectricsCommittee MemberShinjiYokogawaUEC
Gate/MOL DielectricsCommittee MemberErikBuryIMEC
IC Product ReliabilityTopic ChairFengXiaIntel
IC Product ReliabilityVice ChairSouhirMhiraMentor Graphics
IC Product ReliabilityPast ChairBrianPedersenIntel
IC Product ReliabilityCommittee MemberJae-GyungAhnXilinx
IC Product ReliabilityCommittee MemberCongLinNvidia
IC Product ReliabilityCommittee MemberShou-EnLiuMediatek
IC Product ReliabilityCommittee MemberStevenMittlIBM
IC Product ReliabilityCommittee MemberBalajiNarasimhamBroadcom Limited
IC Product ReliabilityCommittee MemberJ. R.ShihTSMC
MemoryTopic ChairAndreaChimentonIntel
MemoryVice ChairLucaPerniolaCEA
MemoryPast ChairAlessandroSpinelliPolitecnico di Milano
MemoryCommittee MemberDimitriHoussameddineIBM
MemoryCommittee MemberMing-YiLeeMacronix
MemoryCommittee MemberJoeMcCrateMicron
MemoryCommittee MemberKab-JinNamSamsung
MemoryCommittee MemberKenTakeuchiChuo University Japan
MemoryCommittee MemberGeorgTempelInfineon
MemoryCommittee MemberYuriTkachevMicrochip
MemoryCommittee MemberCristianZambelliUniversity of Ferrara
MemoryCommittee MemberWeiZhiqiangRambus
Metallization/BEOL ReliabilityTopic ChairValeriySukharevMentor Graphics
Metallization/BEOL ReliabilityVice ChairBaozhenLiIBM
Metallization/BEOL ReliabilityPast ChairGavinHallON Semi
Metallization/BEOL ReliabilityNew MemberGennadiBersukerAerospace Corporation
Metallization/BEOL ReliabilityCommittee MemberMatsuyamaHideyaSocionext
Metallization/BEOL ReliabilityCommittee MemberSumitKapadiaIntel
Metallization/BEOL ReliabilityCommittee MemberKi-DonLeeSamsung
Metallization/BEOL ReliabilityCommittee MemberMing-HsienLinTSMC
Metallization/BEOL ReliabilityNew MemberStephaneMoreauCEA-LETI
Metallization/BEOL ReliabilityCommittee MemberZsoltTokeiIMEC
Metallization/BEOL ReliabilityCommittee MemberTakamasaUsuiToshiba
Metallization/BEOL ReliabilityNew MemberKong-BoonYeapApple
Process IntegrationTopic ChairHiroshiMikiHitachi
Process IntegrationVice ChairMustaphaRafikST Microelectronics
Process IntegrationPast ChairXavierGarrosCEA-LETI
Process IntegrationCommittee MemberAdrianChasinIMEC
Process IntegrationCommittee MemberJen-HaoLeeTSMC
Process IntegrationCommittee MemberAnisurRahmanIntel
Process IntegrationNew MemberHyun ChulSagongSamsung
Process IntegrationCommittee MemberGuidoSasseNXP
Process IntegrationNew MemberMotoyukiSatoMicron
Process IntegrationNew MemberRichardSouthwickIBM
Process IntegrationNew MemberPurushothamanSrinivasanGlobal Foundries
Reliabiity TestingTopic ChairDerekSlottkeIntel Corporation
Reliability TestingVice ChairJifaHaoOn Semiconductor
Reliability TestingPast ChairKevinManningAnalog Devices
Reliability TestingCommittee MemberHosainFarrQualitau
Reliability TestingNew MemberFlavioGriggioMicrosoft
Reliability TestingNew MemberTimothyMcMullenFormFactor
Reliability TestingCommittee MemberStéphaneMoreauCEA-Leti
Reliability TestingNew MemberJohnOrtegaIntel
Reliability TestingCommittee MemberFiorellaPozzobonSTMicroelectronics
Reliability TestingCommittee MemberBryanRootCeladon Systems
Reliability TestingCommittee MemberDirkRudolphGlobalFoundries
Reliability TestingCommittee MemberPascalSalomeSerma Technologies
Reliability TestingNew MemberLoicTheolierIMS-Université de Bordeaux
Reliability TestingCommittee MemberTimTurnerXact/Texas Semicon Labs
Reliability TestingCommittee MemberYiZhaoZhejiang University
Soft ErrorTopic ChairNihaarMahatmeNXP Semiconductors
Soft ErrorVice ChairIndranilChatterjeeAirbus
Soft ErrorPast ChairMartaBagatinU. Padova
Soft ErrorNew MemberLaurentArtolaOnera
Soft ErrorCommittee MemberEthanCannonBoeing
Soft ErrorNew MemberZacharyDigginsSpace X
Soft ErrorNew MemberYi-PinFangTSMC
Soft ErrorNew MemberNelsonGaspardIntel
Soft ErrorNew MemberSimoneGerardinU. Padova
Soft ErrorNew MemberDaisukeKobayashiISAS JAXA
Soft ErrorNew MemberDanielLimbrickNC A&T
Soft ErrorNew MemberHaibinWangHohai University
Soft ErrorNew MemberShi-JieWenCisco
System ReliabilityTopic ChairRobKwasnickIntel
System ReliabilityVice ChairJaySarkarWestern Digital
System ReliabilityPast ChairGuneetSethiAmazon Lab 126
System ReliabilityNew MemberDigantaDasU. Maryland
System ReliabilityNew MemberVincentHuardST Micro
System ReliabilityCommittee MemberPradeepLallAuburn University
System ReliabilityNew MemberYanLiuMedtronic
System ReliabilityNew MemberKingsukMaitraMicrosoft
System ReliabilityCommittee MemberAmitMaratheGoogle
System ReliabilityNew MemberFlorianMoliereAirbus
System ReliabilityNew MemberYi-ChingOngTSMC
System ReliabilityCommittee MemberDavidSunderlandBoeing (Retired)
TransistorsTopic ChairTiborGrasserTUWien
TransistorsVice ChairJasonCampbellNIST
TransistorsPast ChairSteveRameyIntel
TransistorsCommittee MemberGoelNileshBITS Pilani Dubai Campus
TransistorsCommittee MemberKazukiNomotoSony Semiconductor Solutions
TransistorsCommittee MemberJacopoFrancoIMEC
TransistorsNew MemberDaweiHehTSMC
TransistorsCommittee MemberLucaLarcherUniversity of Modena
TransistorsCommittee MemberChrisLiuHuawei
TransistorsCommittee MemberMontserratNafriaUniversitat Autonoma de Barcelona
TransistorsCommittee MemberJurriaanSchmitzUniversity of Twente
TransistorsNew MemberMiaomiaoWangIBM
TransistorsCommittee MemberPurushothamanSrinivasanGlobalfoundries
TransistorsCommittee MemberRunshengWangPeking University
TransistorsCommittee MemberBonnieWeirBroadcom
Wide BandgapTopic ChairMatteoMeneghiniU. Padova
Wide BandgapVice ChairAivarsLelisUS Army Research Labs
Wide BandgapPast ChairSandeepBahlTI
Wide BandgapCommittee MemberAbhishekBanerjeeON
Wide BandgapCommittee MemberAlbertoCastellazziU. Nottingham
Wide BandgapNew MemberCharlesCheungNIST
Wide BandgapCommittee MemberFerdinandoIucolanoST
Wide BandgapCommittee MemberMartinKuballU. Bristol
Wide BandgapNew MemberDanLichtenwalnerCree-Wolfspeed
Wide BandgapCommittee MemberPeterLoseeGE
Wide BandgapCommittee MemberDavidSheridanAOS
Wide BandgapNew MemberKurtSmith
Wide BandgapCommittee MemberSteveStoffelsIMEC
Wide BandgapCommittee MemberKenichiroTanakaPanasonic
Wide BandgapCommittee MemberDeepakVeereddyInfineon
Wide BandgapCommittee MemberShireenWarnockMIT Lincoln Labs