Topics of Interest

DOWNLOAD the 2016 Call for Papers.

Papers in the following areas are requested.

  • 3D & Packaging (PA)
  • Backend Interconnect Metal Reliability (INTC)
  • Circuit Reliability (CKT)
  • Compound Semiconductor Device Rel. (CD)
  • Electronic System Reliability (SYS)
  • ESD and Latchup (EL)
  • Failure Analysis & Process Integration (FA/PI)
  • FEOL and BEOL Dielectrics (DIEL)
  • Memory & Product IC Reliability (MY/PR)
  • Photovoltaic Device and Module Reliability (PV)
  • Soft Errors (SE)
  • Transistor Reliability Physics (XT)