IRPS

Topics of Interest

DOWNLOAD the 2018 Call for Papers.

IRPS18 is soliciting increased participation in the following areas.

  • Reliability of Wide Bandgap semiconductor power devices
  • Circuit aging
  • Consumer electronics
  • Reliability of 2D NAND Flash replacement technologies
  • 2.5D and 3D packaging

Papers in the following areas are requested.

  • Transistors
  • Gate Dielectrics
  • Beyond CMOS devices
  • Compound/optoelectronics
  • Back-End Reliability
  • Process Integration
  • Failure Analysis
  • Memory
  • Photovoltaics
  • MEMS
  • Circuit Reliability
  • Circuit aging simulations
  • Product IC reliability
  • Consumer Electronics reliability
  • Electronic system reliability
  • Soft errors
  • ESD and latchup
  • 3D assembly
  • Packaging