IRPS

Topics of Interest

DOWNLOAD the 2017 Call for Papers.

IRPS17 is soliciting increased participation in the following areas.

  • System reliability
  • Middle of Line
  • Reliability Tools, Test Methods, and Equipment
  • Extrinsic defect impact on yield and reliability
  • COTS components in high-reliability applications – screening, derating, case studies, design considerations, etc.

Papers in the following areas are requested.

  • Gate Dielectrics
  • Back-End Reliability
  • Transistors
  • ESD and Latchup
  • Soft Errors
  • Memory
  • Product IC Reliability
  • Wide Band-Gap
  • Process Integration
  • Circuit Reliability
  • Circuit Aging Simulation
  • Consumer Electronics Reliability
  • Electronic System Reliability
  • 3D Assembly
  • Packaging
  • MEMS
  • Beyond CMOS Devices
  • Failure Analysis
  • Photovoltaic Devices