IRPS

Committee List

IRPS 2018 Committees

This interactive table shows the complete list of committee members, along with chairs and vice-chairs. The table is sortable by clicking on column headers. The search box uses free-text to find matching instances of whatever is typed. Updates will be added as they become available.

Sub-CommitteeRoleFirst nameLast NameOrganization
3D/2.5D/PackagingMemberLucileArnaudCEA / LETI
3D/2.5D/PackagingChairKothandaramanChandrasekaraIBM Research
3D/2.5D/PackagingMemberKristofCroesIMEC
3D/2.5D/PackagingMemberTroy LGraves-AbeNorthrup Grumman
3D/2.5D/PackagingMemberKangwookLeeAmkor
3D/2.5D/Packagingex ChairAlanLuceroIntel
3D/2.5D/PackagingMemberMurugesanMariappanTohuku Universityersity
3D/2.5D/PackagingMemberC SPremachandranGlobal Foundries
3D/2.5D/PackagingChair - ViceSudarshanRengarajanAmazon Lab 126
3D/2.5D/PackagingMemberBrianRoggemanQualcomm
3D/2.5D/PackagingMemberKatsuyukiSakumaIBM Research
3D/2.5D/PackagingMemberChih-HangTungTSMC
3D/2.5D/PackagingMemberLorisVendrameMicron
Circuit Reliability/AgingMemberFlorianCachoSTMicroelectronics
Circuit Reliability/AgingMemberKevinCaoArizona State Universityersity
Circuit Reliability/AgingMemberKarlHofmannInfineon
Circuit Reliability/AgingMemberKevinHuangTSMC
Circuit Reliability/AgingChairChrisKimUniversityersity of Minnesota
Circuit Reliability/AgingMemberKazutoshiKobayashiKyoto Institue of Technology
Circuit Reliability/AgingChair - ViceGeorgiosKonstadinidisOracle
Circuit Reliability/AgingMemberTomKopleyONSemiconductors
Circuit Reliability/AgingMemberHaldunKufluogluQualcomm
Circuit Reliability/AgingMemberPong-FeiLuIBM
Circuit Reliability/Agingex ChairVijayReddyTexas Instruments
Circuit Reliability/AgingMemberJimTschanzIntel
Dielectrics - Gate, MOL, BEOLMemberErikBuryIMEC
Dielectrics - Gate, MOL, BEOLMemberKristofCroesIMEC
Dielectrics - Gate, MOL, BEOLMemberMartinGallFraunhofer Institute
Dielectrics - Gate, MOL, BEOLMemberThomasKaueraufSamsung Electronics
Dielectrics - Gate, MOL, BEOLChair - ViceAndrewKimIBM
Dielectrics - Gate, MOL, BEOLMemberMarioLanzaSoochow Universityersity
Dielectrics - Gate, MOL, BEOLex ChairYung-HueiLeeTSMC
Dielectrics - Gate, MOL, BEOLMemberShou ChungLeeTSMC
Dielectrics - Gate, MOL, BEOLMemberJoelPlawskyRensselaer Poly
Dielectrics - Gate, MOL, BEOLMemberChetanPrasadIntel
Dielectrics - Gate, MOL, BEOLMemberFrancesco MariaPuglisiUniMORE
Dielectrics - Gate, MOL, BEOLChairNagarajanRaghavanSingapore Universityersity of Technology and Design
Dielectrics - Gate, MOL, BEOLMemberTianShenGlobalFoundries
Dielectrics - Gate, MOL, BEOLMemberNaohitoSuzumuraRenesas
Dielectrics - Gate, MOL, BEOLMemberStanislavTyaginovTU Wien
Dielectrics - Gate, MOL, BEOLMemberShinjiYokogawaUEC
ESD/LatchupChair - ViceGianlucaBoselliTexas Instruments
ESD/LatchupMemberLorenzoCeratiST Microelectronics
ESD/LatchupMemberShih-HungChenIMEC
ESD/LatchupMemberZhongChenUniversityersity of Arkansas
ESD/Latchupex ChairFarzanFarbizApple
ESD/LatchupMemberHaraldGossner                Intel
ESD/LatchupChairMichaelKhazhinskySilicon Labs
ESD/LatchupMemberTimothyMaloneyIntel, Emeritus                                                                                  
ESD/LatchupMemberMotoOkushimaRenesas
ESD/LatchupMemberMayankShrivastavaIndian Institute of Science
ESD/LatchupMemberMichaelStockinger         NXP
ESD/LatchupMemberTeruoSuzukiSocionext Inc.                                                                                   
Failure AnalysisMemberJayhoonChungTI
Failure AnalysisMemberBrandenForanThe Aerospace Corporation
Failure AnalysisChairKevinJohnsonIntel
Failure AnalysisMemberEckhardLangerGlobalFoundries
Failure AnalysisMemberJaneLiNVidia
Failure AnalysisChair - ViceBaohuaNiuTSMC
Failure AnalysisMemberKenRodbellIBM
Failure Analysisex ChairBryanTracyEAG Laboratories
Failure AnalysisMemberWilliamVanderlindeIARPA
MemoryChair - ViceAndreaChimentonIntel
MemoryMemberBobGleixnerMicron
MemoryMemberMing-YiLeeMacronix
MemoryMemberMasahikoNakayamaToshiba
MemoryMemberKab-JinNamSamsung
MemoryMemberHokyungParkSKHynix
MemoryMemberLucaPerniolaCEA
MemoryChairAlessandroSpinelliPolitecnico di Milano
MemoryMemberCristianZambelliUniversityersity of Ferrara
Metallization ReliabilityChairGavinHallON Semi
Metallization ReliabilityMemberMatsuyamaHideyaSocionext
Metallization ReliabilityMemberSumitKapadiaIntel
Metallization ReliabilityMemberKi-DonLeeSamsung
Metallization ReliabilityMemberBaozhenLiIBM
Metallization ReliabilityMemberMing-HsienLinTSMC
Metallization ReliabilityMemberYu-LinShenUniversityersity of New Mexico
Metallization ReliabilityChair - ViceZsoltTokeiIMEC
Metallization ReliabilityMemberTakamasaUsuiToshiba
Photovoltaicsex ChairAndreaCesterUniPD
PhotovoltaicsChairMichaelDaenenHasselt Universityersity
PhotovoltaicsMemberNeelkanth GDhereUniversityersity of Central Florida
PhotovoltaicsMemberCosimoGerardiENEL
PhotovoltaicsMemberSurenGevorgyanDTU
PhotovoltaicsMemberSalvatoreLombardoIMM-CNR
PhotovoltaicsMemberMirjamTheelenSolliance
PhotovoltaicsMemberKoenVandewalIAPP
PhotovoltaicsMemberEszterVoroshaziimec
PhotovoltaicsMemberShenghaoWangOIST
PhotovoltaicsMemberMartinWeisSTUBA
PhotovoltaicsChair - ViceKarl-AndersWeissFraunhofer - ISE
Process IntegrationMemberAdrianChasinIMEC
Process IntegrationChairXavierGarrosCEA - LETI
Process IntegrationMemberMinjungJinSamsung
Process Integrationex ChairAndreasKerberGlobal Foundries
Process IntegrationMemberSiddarthKrishnanApplied materials
Process IntegrationMemberJen-HaoLeeTSMC
Process IntegrationChair - ViceBarryLinderIBM
Process IntegrationMemberHiroshiMikiHitachi
Process IntegrationMemberMustaphaRafikST Microelectronics
Process IntegrationMemberAnisurRahmanIntel
Process IntegrationMemberGuidoSasseNXP
Product ReliabilityMemberJohnAgnessRohm Semi
Product ReliabilityMemberJae-GyungAhnXilinx
Product ReliabilityChair - VicePierre Chor-FungChiaCisco
Product ReliabilityMemberMinhyeok (MH)ChoeSamsung
Product ReliabilityMemberChang Yeol (CY)LeeSK Hynix
Product ReliabilityMemberShou-EnLiuMediatek
Product ReliabilityMemberSouhirMhiraSTmicroelectronic
Product ReliabilityMemberStevenMittlIBM
Product ReliabilityMemberHomiMogulQualcomm
Product ReliabilityMemberBalajiNarasimhamBroadcom Limited
Product ReliabilityChairBrianPedersenIntel
Product ReliabilityMemberJ. R.ShihTSMC
Product ReliabilityMemberKong BoonYeapGlobal Foundries
Reliability TestingMemberShih-ChangChenTSMC
Reliability Testingex ChairHosainFarrQualitau
Reliability TestingMemberJifaHaoOn Semiconductor
Reliability TestingMemberRobertHigginsTexas Instruments
Reliability TestingChairKevinManningAnalog Devices
Reliability TestingMemberStéphaneMoreauCEA-Leti
Reliability TestingMemberFiorellaPozzobonSTMicroelectronics
Reliability TestingMemberBryanRootCeladon Systems
Reliability TestingMemberDirkRudolphGlobalFoundries
Reliability TestingMemberPascalSalomeSerma Technologies
Reliability TestingChair - ViceDerekSlottkeIntel
Reliability TestingMemberTimTurnerXact/Texas Semicon Labs
Reliability TestingMemberYiZhaoZhejiang University
Soft ErrorMemberThiagoAssisRCI
Soft ErrorChairMartaBagatinUniversityersity of Padova
Soft ErrorMemberBharatBhuvaVanderbilt Universityersity
Soft ErrorMemberEthanCannon Boeing
Soft ErrorMemberIndranilChatterjeeAirbus
Soft ErrorMemberAdrianEvansiRoC
Soft ErrorMemberMatthewGadlage NAVSEA Crane
Soft ErrorMemberGillesGasiotSTMicroelectronics
Soft ErrorMemberShahJahinuzzamanIntel
Soft ErrorMemberMichaelKingSandia Labs
Soft ErrorMemberDaisukeKobayashi JAXA
Soft ErrorChair - ViceNihaarMahatmeNXP Semiconductors
Soft Errorex ChairBalajiNarasimhamBroadcom
Soft ErrorMemberPhilOldigesIBM
Soft ErrorMemberTaikiUemuraSamsung
Soft ErrorMemberHaibinWangHohai University
Soft ErrorMemberShi-JieWenCisco
System Reliabilityex ChairRandyCrutchfieldMedtronic
System ReliabilityMemberAjayKamathGoogle
System ReliabilityMemberHeejinKimSamsung Display (Development Quality and Reliability Group)
System ReliabilityMemberBobKnoellNXP Semiconductors
System ReliabilityChair - ViceRobKwasnickIntel
System ReliabilityMemberPradeepLallAuburn University
System ReliabilityMemberAmitMaratheGoogle
System ReliabilityMemberJaySarkarWestern Digital
System ReliabilityMemberYanosSazeidesUniversity of Cyprus
System ReliabilityChairGuneetSethiAmazon Lab 126
System ReliabilityMemberDavidSunderlandBoeing (Retired)
Transistors/Beyond CMOSMemberJasonCampbellNIST
Transistors/Beyond CMOSMemberEun-AeChungSamsung
Transistors/Beyond CMOSMemberSumanDattaNorte Dame Universityersity
Transistors/Beyond CMOSMemberXavierFederspielSTMicroelectronics
Transistors/Beyond CMOSMemberJacopoFrancoIMEC
Transistors/Beyond CMOSChair - ViceTiborGrasserTUWien
Transistors/Beyond CMOSMemberLucaLarcherUniversityersity of Modena
Transistors/Beyond CMOSMemberChrisLiuHuawei
Transistors/Beyond CMOSex ChairSouvikMahapatraIndia Institute of Technology
Transistors/Beyond CMOSMemberSouvikMahapatraIndia Institute of Technology
Transistors/Beyond CMOSMemberMontserratNafriaUniversityersitat Autonoma de Barcelona
Transistors/Beyond CMOSChairSteveRameyIntel
Transistors/Beyond CMOSMemberJurriaanSchmitzUniversityersity of Twente
Transistors/Beyond CMOSMemberRickiSouthwickIBM
Transistors/Beyond CMOSMemberPurushothamanSrinivasanGlobalfoundries
Transistors/Beyond CMOSMemberBonnieWeirBroadcom
Transistors/Beyond CMOSMemberChadYoungUT
Wide Band GapChairSandeepBahlTI
Wide Band GapMemberAbhishekBanerjeeON
Wide Band GapMemberAlbertoCastellazziU. Nottingham
Wide Band GapMemberFerdinandoIucolanoST
Wide Band GapGaNSPEC LiaisonRobertKaplarSandia labs
Wide Band GapMemberTsunenobuKimotoKyoto Universityersity
Wide Band GapMemberMartinKuballU. Bristol
Wide Band GapMemberAivarsLelisUS Army Research Labs
Wide Band GapMemberPeterLoseeGE
Wide Band Gapex ChairDenisMarconIMEC
Wide Band GapChair - ViceMatteoMeneghiniU. Padova
Wide Band GapMemberDavidSheridanAOS
Wide Band GapMemberKurtSmithTransphorm
Wide Band GapMemberSteveStoffelsIMEC
Wide Band GapMemberKenichiroTanakaPanasonic
Wide Band GapMemberDeepakVeereddyInfineon
Wide Band GapMemberShireenWarnockMIT Lincoln labs