Abstract Submission

Submissions for IRPS 2018 are expected until October 9, 2017!

Please read everything on this screen before submitting your paper.

The 2018 IEEE International Reliability Physics Symposium will be held
March 11-15, 2018 at the Hyatt Regency San Francisco airport, Burlingame, CA, USA.

IRPS offers its attendees technical sessions, tutorials, workshops, a year-in-review seminar and a poster session, all covering state-of-the-art developments in the reliability physics of electronic and optoelectronic devices, materials, and systems. Attendees returning from the IRPS will be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their companies’ bottom line.

To submit your 2-page abstract, follow these instructions:

  1. Read all of this page to ensure you understand the process.
  2. Download the Abstract Submission Guide HERE.
  3. Download an example abstract HERE.
  4. Submit your abstract by clicking HERE 

Abstracts are due by 11:59 PM EDT on October 09, 2017. All abstracts must be submitted electronically. Only pdf file format can be accepted. Abstracts exceeding two pages in length will not be accepted; the paper size must be either 8.5″ x 11″ (Letter) or A4. The minimum allowable font size is 10 point Times New Roman or 11 point Calibri. Abstracts typically contain one page of text and one page of figures. The work described in your abstract must be original. The abstract should highlight the novelty of the work and place it in the context of previous works. Specific results (e.g. data or model equations) must be provided to demonstrate that the work is complete and to allow for the outcomes to be evaluated. Following abstract review, full manuscripts of accepted papers will be due before the conference.

Full-length manuscripts with late breaking news may be considered for inclusion in the conference/proceedings. These are due by January 8, 2018.


  • Identify new or improve our understanding of the physics of failure and modeling of mechanisms in electronic and optoelectronic devices, materials, and systems;
  • Identify how fabrication processes influence the susceptibility of product to particular physical failure mechanisms;
  • Quantify the impact of device and circuit design, as well as material and process selection on reliability;
  • Present new, innovative, or improved failure analysis techniques;
  • Describe reliability testing/stressing, qualification, and screening methodologies or strategies for materials, devices, circuits, or chips; either at wafer- or module-level for commercial or “extreme” environments;
  • Demonstrate techniques to build-in or extend reliability while meeting performance goals, especially as technologies are scaled.


In addition to the Best & Outstanding Paper awards and the Best Poster award, IRPS will be presenting a Best Student Paper Award. To qualify for the student paper award, the IRPS oral presentation must be given by a student and the first author must be that same student. Please indicate upon submission of an abstract if you would like to be considered for this award.